Hiring Wire Bond Engineer in Malaysia

Power Horizon International Resources, Inc. is a land based recruitment agency duly licensed by the (POEA) Philippine Overseas Employment Administration and Department of Labor and Employment (DOLE) Specializing in the career placement of Filipino professionals and skilled workers for overseas employment.

Power Horizon International Resources, Inc. is a land-based overseas human resource agency registered with the Securities and Exchange Commission (SEC), licensed by the Philippine Overseas Employment Administration (POEA) since 2003, and member in good standing.

Introduce and maintain Wire Bond Assembly processes and activities to ensure the requested requirements from manufacturing and quality are achieved. Contribution to reach Continental Automotive, Division, BU and Seguin operational targets to optimize the efficiency of the manufacturing and quality processes. Core Responsibilities are; 1. Responsible for supporting process development of Aluminum Wedge Bond process technologies in automotive manufacturing applications. 2. Works with cross functional teams to determine application specific process requirements. 3. Provides lessons learned input to design / development through DFM, Design for Manufacturing, reviews. 4. Provides new product build support through tooling development and procurement. 5. Introduces and maintains process programs and process parameters to support manufacturing operations. 6. Responsible for process documentation, Setup Matrix / Parameter Cards / Work Instructions / Process Guides. 7. Plans and conducts process characterization for manufacturing equipment and processes. 8. Responsible for Process Characterization On Time Percentage Performance. 9. Responsible for Equipment Efficiency improvement projects 10. Drives activities for OEE, Scrap, Yield and DPMO improvement to support plant performance metrics. 11. Supports Scrap reduction efforts through problem solving and process optimization. 12. Advanced manufacturing line problem solving related to manufacturing process related defects. 13. Drives Lean Manufacturing Initiatives through basic TPM, Kaizen and Lean methods. 14. Supports Customer Audits and Visits through knowledge and process sharing and 15. Supports TPM program by providing mentoring and training to peers, technicians and operator personnel.
Identifies and documents projects in CBS, 8D, and 5Why formats for review with engineering and management.

The wire bond process development engineer is responsible for the definition, development, execution, and qualification of semiconductor assembly processes to meet product requirements and to enable timely new product introduction. Responsibilities. In the position of Wire bond process engineer you are responsible for optimizing, developing, qualifying and preparing the production of Wire bond processes and materials. A Process Engineer, or Manufacturing Process Engineer, designs and implements systems and equipment procedures used manufacturing facilities. Their main duties include testing and monitoring equipment, updating current system processes and conducting risk assessments.

Wire bonding forms an interconnection between a chip to a substrate, substrate to substrate, or substrate to a package. Wire bonding is generally considered the most cost-effective and flexible interconnect technology, and is used to assemble the vast majority of semiconductor packages today. Wire bonding has been the more popular method due to its low cost, flexibility and large installed base. Why Do Engineers Make So Much? Engineers’ high earnings are commensurate with the role’s required technical skills, which are extremely high in demand. Furthermore, many industries are becoming more technical in nature, which also drives up the need for engineers with both unique technical skills and soft skills. Process engineers should have a bachelor’s degree in chemical, manufacturing or industrial engineering. Concentrations in chemistry, mathematics and management are helpful as well. Some employers ask for advanced or master’s degrees for specialized or senior process engineer positions.

Wire Bond Engineer in Malaysia

Vacancies: 10
Salary per month: MYR 5,000-6,000 (Around Php 63,665.79- 76,398.95 )
Deadline: November 4, 2022

Job Description

Train, motivate and supervise a team of technicians to achieve
Provide technical solutions to process issues.
Develop and Monitor Yield, Quality, Productivity Improvement Activities and Cost Reduction Programs.
Develop new processes and sources for materials, and equipment for continuous breakthrough improvement
Review and ensure customers’ specifications have been complied with.

Qualifications

A minimum of 3 year(s) of working experience is required.
Candidates must be a Profl License(Passed Board/Bar/Profl License Exam) holder.
Male applicants are preferred for this role.
Experience in a semiconductor manufacturing environment
Experience in the Wire Bonding area will be an added advantage.
Good communication and analytical skills.

Principal / Employer: Carsem Sdn. Bhd.

Principal / Employer Address: Jalan Lapangan Terbang, P.O. Box 204, 30720 Ipoh, Perak, Malaysia

Placement Fee: Please be reminded that as per POEA regulations, the placement fee is up to a maximum of one (1)
month’s salary.

Note:

For manpower pooling only. No fees in any form and/or purpose will be collected from the applicants. Beware of illegal recruiters and human traffickers.

How to Apply:

For interested applicants please click the link to apply: and be sure to upload your updated CV or resume.

For rurther intormation, you may contact the recruitment agency at telephone number 815-1077 or submit
your application via email so the recruiter can contact you for further instructions. Walk in applicants can
also visit the agency to submit their CV for immediate sCreening. The office of Principalia Management &
Personnel Consultants, Inc. is located at Units 701&702, 7/F, Alexander House, Condominium, Legaspi
Village, Makati city, Philippines.

Source: Work Abroad PH